ASUS unveiled New Technology in Various Courtiers
The technical seminar covered three contenents
Nov 16, 2010
ASUS has completed a series of technical seminars that showcased its latest motherboard innovations. Attendees were mostly members of global media outlets.
Held around the world between October 30 and November 15, the seminars provided a stage for several new ASUS technologies, all featured on upcoming ASUS motherboards that use new Intel P67 and H67 chipsets. These include the pioneering Dual Intelligent Processors motherboard design that features two dedicated co-processors for performance and power management, the TurboV Processing Unit (TPU) and Energy Processing Unit (EPU). Attendees were also treated to an introduction of next-generation Dual Intelligent Processors 2 with DIGI+ VRM digital power management.
Brand new motherboards from ASUS’ celebrated Republic of Gamers brand were also on show, as were ruggedized models from its TUF (The Ultimate Force) range. These high-performance motherboards have some of the most sophisticated overclocking capabilities in the world, along with superior cooling technology.
The ASUS Autumn 2010 Technical Seminars took place in Germany, England, Taiwan, France, the United States, Japan, China, Singapore and Korea.